JPH0556860B2 - - Google Patents

Info

Publication number
JPH0556860B2
JPH0556860B2 JP23970586A JP23970586A JPH0556860B2 JP H0556860 B2 JPH0556860 B2 JP H0556860B2 JP 23970586 A JP23970586 A JP 23970586A JP 23970586 A JP23970586 A JP 23970586A JP H0556860 B2 JPH0556860 B2 JP H0556860B2
Authority
JP
Japan
Prior art keywords
package
leads
island
stitches
island portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP23970586A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6393139A (ja
Inventor
Yasushi Tomijima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP23970586A priority Critical patent/JPS6393139A/ja
Publication of JPS6393139A publication Critical patent/JPS6393139A/ja
Publication of JPH0556860B2 publication Critical patent/JPH0556860B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP23970586A 1986-10-07 1986-10-07 半導体集積回路装置 Granted JPS6393139A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23970586A JPS6393139A (ja) 1986-10-07 1986-10-07 半導体集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23970586A JPS6393139A (ja) 1986-10-07 1986-10-07 半導体集積回路装置

Publications (2)

Publication Number Publication Date
JPS6393139A JPS6393139A (ja) 1988-04-23
JPH0556860B2 true JPH0556860B2 (en]) 1993-08-20

Family

ID=17048695

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23970586A Granted JPS6393139A (ja) 1986-10-07 1986-10-07 半導体集積回路装置

Country Status (1)

Country Link
JP (1) JPS6393139A (en])

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2522455B2 (ja) * 1990-09-13 1996-08-07 三菱電機株式会社 半導体集積回路装置
US5965936A (en) 1997-12-31 1999-10-12 Micron Technology, Inc. Multi-layer lead frame for a semiconductor device
AU4152096A (en) * 1994-11-10 1996-06-06 Micron Technology, Inc. Multi-layer lead frame for a semiconductor device
US6054754A (en) * 1997-06-06 2000-04-25 Micron Technology, Inc. Multi-capacitance lead frame decoupling device
US6515359B1 (en) 1998-01-20 2003-02-04 Micron Technology, Inc. Lead frame decoupling capacitor semiconductor device packages including the same and methods
US6114756A (en) 1998-04-01 2000-09-05 Micron Technology, Inc. Interdigitated capacitor design for integrated circuit leadframes
JP3923174B2 (ja) * 1998-04-28 2007-05-30 富士通株式会社 ヘッドアセンブリ及びサスペンション

Also Published As

Publication number Publication date
JPS6393139A (ja) 1988-04-23

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees